Equipment

Measurement equipment

Our group works has extensive experience with measurements on integrated optics devices. For this, laser light is sent onto the chips using a fiber array that is positioned above on-chip grating couplers. The lasers that we use are typically tunable semiconductor lasers that operate at telecom wavelengths (around 1550 nm).

The measurements on mechanical systems are typically done in vacuum, to minimize the damping due to the surrounding air. These mechanical devices operate at high frequencies (100 kHz - 10 GHz) which requires spectrum and network analyzers that can reach these frequencies.

Our integrated quantum optics chips contain superconducting single-photon detectors which have to be cooled to temperatures close to the absolute zero. This is done in dedicated cryostats with electrical and fiber access.

The Oxford PlasmaPro 80 NGP etcher

Nanofabrication

Making state-of-the art chips using advanced nanofabrication techniques is a major part of our research. This is carried out in close collaboration with the Walther Meißner Institute for Low Temperature Research (WMI), the Walter Schottky Institute (WSI), and its Center for Nanotechnology and Nanomaterials (ZNN). We operate the new reactive-ion etcher (RIE) with an inductivly-coupled plasma (ICP) in the ZNN cleanroom. The Oxford PlasmaPro 80 can be operated in RIE and ICP mode, has a temperature controlled sample platen (0 - 80 oC) and helium backing. The following gasses are installed: CF4, CHF3, SF6, C4F8, O2, Ar, Cl2 and BCl3. The system can in principle etch wafers up to 100 mm, but is designed to work with small samples. Since the etcher is used to create high-quality optomechanical structures and low-loss optical waveguides, not all samples are allowed. Click here for more information.

This system has been purchases with support from the Nanosystems Initiative Munich (NIM) and TUM-IAS.